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Additional info for Advances in Joining of Ceramics, Volume 138
The effect of metallization on alumina surfaces on Ti/Al203 bonding was examined. The metallization was carried out by vacuum deposition. The thickness, dm, of Ti deposition layer onto the A1203 surface was changed from 0 to 160 nm. The annealing (metallizing) was carried out for 30 min at the bonding temperature before bonding. RESULTS AND DISCUSSION 1. Bonding of similar materials Fig. 4 (a) and (b) show the diffusion bonding mechanism maps for Cu/Cu and Ni/Ni bonding, respectively. 0 |im (see Fig.
If the design is driven simply by a reduction in the maximum tensile stress anywhere in the joint, it is likely to be overly conservative, since failure may not initiate from that location. Alterations in the joint design may alter the entire stress distribution, and this alteration may occur nonuniformly across the joint. Furthermore, the stress at the tip of a crack-like flaw is likely to be mixed shear and opening mode, and thus, the crack will be driven to kink in a direction of maximum tensile stress.
Fig. 7 suggests that the deformation mechanisms facilitated with increasing P is useful for obtaining a larger S and a smaller Sm. Because the interdiffusion is considered to be an accompanying phenomenon of the diffusion bonding, the diffusion layer produced should be limited by full contact (end of the void shrinkage). Fig. 8 shows the thickness of interdiffusion layer SF to obtain S = 100%. It is 40 Advances in Joining of Ceramics 100 £ •L found that 5 f scarcely depends on T. This reason is explained in terms of the bonding time tF taken to obtain S = 100%.
Advances in Joining of Ceramics, Volume 138